Careers in high-radiation Environment Technologies
Marie Curie Initial Training Network

Development of radiation hard, high density electronics and interconnection with sensors
TALENT Electronics Research concerns the development and validation of the newly developed FEI4 chip bump-bonded to sensors of the three different technologies. For the chip this means in particular the digital functionality, the new control and data output, the powering options and the analogue performance. The highly segmented independent powering now adopted for the LHC trackers becomes impractical at the HL-LHC for reducing space, material and heat dissipation. Thus, novel solutions to the power distribution challenge must be identified and developed to maturity.
ATLAS FE-I4 pixel readout chip
Event Calendar

TALENT 2nd Joint training course, May 26-29, 2014

The TALENT 2nd Joint training course will take place at CERN on May 26-29, 2014.
More...

TALENT Midterm Review and 2nd Annual Meeting, November 18-20, 2013

The TALENT Midterm Review and 2nd Annual Meeting will take place at CERN on November 18-20, 2013.
More...

TALENT Summer School, June 3-14, 2013

The TALENT Summer School at CERN will take place on June 3-14, 2013.
More...

ATLAB Annual Assembly; EDUSAFE ITN and TALENT ITN joint technology workshop, February 18, 2013

The ATLAB Annual Assembly; EDUSAFE ITN and TALENT ITN joint technology workshop at CERN will take place on February 18, 2013.
More...

TALENT 1st Annual meeting, October 8-9, 2012

The TALENT 1st Annual meeting at CERN will take place on October 8-9, 2012.
More...

TALENT 2nd Kick-off and 1st Network meeting, June 11-15, 2012

The TALENT 2nd Kick-off and 1st Network meeting at CERN will take place on June 11-15, 2012.
More...

TALENT Kick-off meeting, January 16, 2012

The first TALENT Kick-off meeting at CERN will take place on January 16, 2012.
More...