Careers in high-radiation Environment Technologies
Marie Curie Initial Training Network

TALENT Electronics Research concerns the development and validation of the newly developed FEI4 chip bump-bonded to sensors of the three different technologies. For the chip this means in particular the digital functionality, the new control and data output, the powering options and the analogue performance. The highly segmented independent powering now adopted for the LHC trackers becomes impractical at the HL-LHC for reducing space, material and heat dissipation. Thus, novel solutions to the power distribution challenge must be identified and developed to maturity.